3D SPI – Icon Series
Magic-ray · Solder paste inspection
The Magic-ray 3D SPI Icon Series delivers precision 3D solder-paste inspection after stencil printing. Intelligent zero-reference technology, combined 3D and colour algorithms and SPC data analysis measure the volume, area, height and offset of every deposit for closed-loop print-process control.
Product Features:
- Full 3D measurement – Volume, area, height and offset of every deposit.
- Intelligent zero-reference – Stable measurement with combined 3D and colour algorithms.
- Closed-loop SPC – Feeds data back to the printer for process correction.